circuitnet
Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 6, 2025

Rick Perkins, Chemical Process Engineer, Chem Logic

As we step into 2025, CheckSum is poised for significant growth and innovation. Our focus remains on addressing the evolving needs of major electronics manufacturers, who are increasingly recognizing the necessity of parallel testing to keep pace with their SMT lines. Traditional test strategies can no longer match the speed and efficiency required, leading to either increased costs or untested inventory.

At Electronica in Munich, we proudly introduced the ILS-X2, our latest inline system capable of testing two panels simultaneously. This advancement, combined with our Multi-Core ICT, Multi-Writer On-Board Programming, and Parallel Functional Test technologies, offers unparalleled speed and efficiency. These innovations ensure that high-volume manufacturers can maintain their production rates without compromising on quality.

Looking ahead, we are committed to further enhancing our parallel testing solutions. This unique approach is attracting the interest of the world's most sophisticated manufacturers, who realize that the process problems created when testing doesn't keep up with the SMT line must be solved.

Our goal is to provide our clients with the tools they need to stay ahead in a rapidly changing industry. With a strong foundation and a clear vision, CheckSum is ready to lead the way in 2025 and beyond.
Rick Perkins
Chemical Process Engineer, Chem Logic
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling