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Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 7, 2025

Stan Renals, CEO, Cobar Europe & Cobar Solder Products

The manufacturing outlook for North America in 2025 looks great!

We represent companies that manufacture parts cleaning equipment and solvents, and our order backlog has never been higher. Most companies have recognized that parts cleaning is a key step in their production process and they are upgrading their technology and equipment.

Most are moving away from water-based cleaning processes and incorporating parts cleaning processes that recycle solvents by distillation. Modern, non-flammable solvents exhibit high-solubility with reduced waste streams from water-based cleaning processes.

Vacuum degreasing with non-flammable blended solvents is the most efficient, with a 90% reduction in solvent usage. Reduced energy, smaller waste streams, and better cleaning results, without the risk of leaving water residues on the components, is the main reason that customers move to use vapor degreasing / defluxing equipment and nonflammable solvents.
Stan Renals
CEO, Cobar Europe & Cobar Solder Products
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling