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Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
Viewpoint
February 17, 2025

Simon Hofer, CEO/President, Infotech Automation Inc.

In today’s competitive environment, automation is a necessity, automation is at the core of everything we do. To achieve maximum efficiency, precision, and consistency, manual processes must be minimized, and automated solutions should take center stage.

Our new SMT rework systems and the new 2025 models are designed with automated functions like motorized XY PCB holders, automatic theta angle adjustments, and automatic alignment. Our future (AI) fully automated rework systems as well will help optimize processes by predicting machine failure, improving placement accuracy, and managing complex Thermo profiles. Since the SMT industry is continuously evolving with new technologies and increased demands for speed and precision.

Our goal is not just to keep up with the industry, but to be in parallel with its anticipating trends, responding to challenges, and delivering effective solutions. Today factors such as ongoing geopolitical tensions, labor shortages continue to impact supply chains, it had improved in many ways, but were still present in some areas, and many industries faced challenges in attracting and retaining talent, particularly in fields such as technology.

As for DEN-ON INSTRUMENTS, we are offering better wages, benefits, and flexible work arrangements to address these challenges.
Simon Hofer
CEO/President, Infotech Automation Inc.
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Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling