Newer applications such as AI, 5G, IoT, ADAS, AR/VR and others are opening-up multiple growth opportunities for the semiconductor industry. The adoption of these technologies is generating demand for increased performance. The industry is exploiting the power advantages of lower-node technology, wide-bandgap (WBG) materials and advanced packaging (AP) to accommodate increased functionality on a single small form - making production processes even more challenging.
These advances in semiconductor technology and device complexity are stepping up the pressure on monitoring and controlling for semiconductor packaging processes. Processes optimization is a prerequisite for high reliability, which is achieved by selecting appropriate materials and controlling critical process parameters.
Optical and displacement sensors together with electrical testing are currently the most widespread methods used for chip testing and monitoring/control of packaging processes. However, improved methods for process monitoring and failure identification are needed to maintain or improve the quality and yield of a packaging process.
Force, as a physical quantity causing a device failure, may not be accessible to conventional measuring methods, but it plays an equally important part in controlling and monitoring production processes such as bonding, pick-and-place and encapsulation.
Thanks to piezo dynamic force measurement technology, forces can be monitored and controlled with high resolution - even when the forces involved are low. This makes it possible to detect deviations at an early stage; errors can be avoided, and semiconductor equipment manufactures can achieve higher and more accurate machine performance. Manufacturing and packing companies in the semiconductor industry thus benefit from higher process visibility, enhanced performance, lower quality costs and traceability of process data.
The existing complexities of semiconductor production processes are set to increase even further in the future, creating the need for new methods of improving the quality and yield of wafer, packaging, and test processes.
Dynamic piezoelectric force measurement technology offers many advantages that optimally meet the requirements of semiconductor process applications including:
- High dynamic measurements
- High resolution and repeatability- even for low forces
- Stiffness - no wear - long life span
- Compact sensor size
Force measurements improve the identification of failures by making mechanical stress and process deviations visible.
This approach helps users to:
- Achieve higher quality (and reduce ppm failure rate)
- Increase machine performance (in terms of speed and accuracy)
- Benefit from traceability and Big Data by measuring the critical process variable of force.
