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Plan Ahead for BGA Device Upgrades
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Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
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Continuous Improvement: The Task That Never Ends in the Cleaning World



Continuous Improvement: The Task That Never Ends in the Cleaning World
The job of a cleaning agent is to remove an unwanted contaminant, or simply some kind of “dirt”. How can you efficiently remove that soil while minimizing total waste and improving worker safety? While that answer evolves based on updated impact studies and new regulations, the goal of removing those undesired contaminants remains fixed.

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Authored By:
Erik Miller, Ram Wissel
KYZEN Corporation
Tennessee, USA

Summary

The job of a cleaning agent is to remove an unwanted contaminant, or simply some kind of “dirt”. How can you efficiently remove that soil while minimizing total waste and improving worker safety? While that answer evolves based on updated impact studies and new regulations, the goal of removing those undesired contaminants remains fixed. Responsible environmental stewardship challenges businesses to continuously evaluate safer or preferred process alternatives. Such as reducing waste or selecting products that are safer for their employees and the environment. This paper investigates a methodology for developing new processes that achieve the required cleaning effectiveness while balancing the environmental, human, and machine impacts for longevity.

Conclusions

As soldering materials continue to advance and evolve with jettable pastes, lower melting point alloys, and synthetic resins the nature of the flux residue(s) will continue to present different cleaning challenges and opportunities to improve cleaning agents.

Developing higher-performance, lower-cost cleaning agents which minimize environmental and human impact requires continuous improvement. It’s a task that never ends.

Initially Published in the SMTA Proceedings
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Uyemura
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