Accelerated Corrosion Testing of DRAM Modules for Data Centers

Kwangwon Seo, Keunho Rhew, Jinsoo Bae, Yuchul Hwang
Samsung Electronics
Hwaseong-si, Korea

Corrosion issues of electronic devices have been steadily reported in data centers due to gaseous chemicals introduced from outside, as free air cooling systems were utilized to reduce energy. To investigate corrosion problems in electronic products for server applications, mixed flowing gas (MFG) is widely used as an accelerated testing method. However, conventional MFG testing exhibits systematic issues that do not accurately replicate real environments and demonstrate deviations in each evaluation even under identical test conditions. Furthermore, it is difficult to precisely estimate the field environment based on test results because the ANSI/ISA-71.04 standard, which defines field corrosion classes, covers a wide range of copper reactivity.

These limitations make it challenging to achieve the intended objectives, potentially leading to incorrect conclusions and decision-making. In this study, to solve these issues, we have proposed a desirable testing methodology that considers the deviations observed in MFG acceleration testing. This methodology encompasses the quantification of the test environment, the determination of an appropriate field-equivalent test duration, and the evaluation of products under suitable conditions.

In addition, based on the test conditions quantified using the proposed method, we verified a conformal coating solution that enables operation even in harsh environments. By employing the precise testing methodology proposed in this study, it is anticipated to contribute to the development of products that meet customer requirements.

In this study, a quantitative investigation was conducted on the MFG accelerated test that can effectively represent corrosion environments of data center. The copper corrosion rate under various conditions was measured, and the test criteria was established by adopting the field environment defined in the ANSI/ISA-71.04 standard. Upon estimating and analyzing the accelerated corrosion environment, it was verified that the variation existed across tests and equipment.

In order to improve conventional MFG testing method, the quantitative evaluation platform considering deviation was proposed. Through the suggested process, it is anticipated that a highly consistent test can be performed by establishing acceleration test conditions and field-equivalent criteria. By evaluating memory module products for data center applications based on the evaluation platform, vulnerable region and mechanism of copper corrosion in the G3 harsh environment could be defined. In addition, it was possible to contribute to securing products that can be used in various environments by verification of conformal coating solution.

Through this study, we anticipate that the proposed quantitative methodology will facilitate establishment of proper test criteria for product qualification, as well as appropriate analysis of corrosion behavior and mechanisms in product. Furthermore, by the improvement solutions, we aim to contribute to the development of products that align with various field requirements.