Heterogeneous Integration Roadmap: Technology for Systems of the Future
The new Heterogeneous Integration Roadmap provides a long-term vision for the electronics industry, identifying future challenges and potential solutions.
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Authored By:
Paul Wesling, IEEE Life Fellow
Hewlett-Packard Co (retired); HI Roadmap Editor
Summary
The new Heterogeneous Integration Roadmap (HIR) provides a long-term vision for the electronics industry, identifying difficult future challenges and potential solutions. Under the sponsorship of SEMI, ASME, and three IEEE Societies, the roadmap offers professionals, industry, academia, and research institutes a comprehensive view of the landscape and strategic technology requirements for the electronics industry’s evolution over the next 15 years, and provides a 25-year vision for the heterogeneous integration of emerging devices and emerging materials with longer research and development timelines. The purpose is to stimulate precompetitive collaboration and thereby accelerate the pace of progress.
The International Technology Roadmap for Semiconductors (ITRS) set the cadence for the Moore’s Law scaling that has been the norm for the semiconductor industry. However, because of scaling, cost and power-dissipation issues, as well as the laws of physics, the final ITRS was issued in 2015. The HIR pulls together many strands of that earlier Roadmap, to focus on microelectronics design, materials and packaging issues. The current version covers 2.5D, 3D, and wafer-level packaging, integrated photonics, MEMS and sensors, and system-in-package (SiP); support areas such as test, thermal, simulation, co-design, and interconnects; as well as application areas such as high-performance computing, 5G, medical, aerospace, automotive, and mobile – detailing both near-term and longer-term metrics and goals. It identifies difficult future challenges and proposes potential solutions. Comprising the output of 22 Technical Working Groups with worldwide participation, it will be substantially updated every two years.
Version 1.0 is available freely for download, as well as in the form of a printed softbound book. Details for accessing this new Roadmap are presented. An invitation is made for involvement in version 2.0, now under preparation.
Conclusions
Electronics packaging is fundamental to innovation in many industry applications and system products, across applications such as cloud computing, IoT, medical and health, automotive, aerospace, consumer, and home. The HI roadmap offers professionals, industry, academia, and research institutes a comprehensive view of the landscape and strategic forecast of technology requirements for the electronics industry’s evolution over the next 15 years. The goal is to stimulate our total ecosystem towards precompetitive collaboration and thereby accelerate the pace of progress.
Work is now underway on version 2.0 of the Roadmap. Technologists are invited to become involved in its preparation; visit eps.ieee.org/hir for a summary of the various Technical Working Groups and for contact information.
The full Roadmap is available as a single PDF download, and also as a ZIP file to place in a directory on a desktop or laptop computer, with full-text search enabled; download at www.pwesling.com/hir. A reference link is given there for purchase of the softbound book. Individual chapters (with updates as they become available) may be downloaded from the IEEE Electronics Packaging Society website, at eps.ieee.org/hir.
Initially Published in the SMTA Proceedings
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