As the next-generation interconnection materials, Cu core column is a kind of cylindrical-shaped copper core with Ni and solder plating. It could replace ordinary solder balls, Cu core balls and even Cu plated posts and has become the focus of attention. Cu core columns have innately ability to control and maintain a consistent standoff height, and can achieve excellent electrical and thermal conductivity due to the excellent physical properties of copper.
It is known that the Cu core column can exhibit sufficient performance compare with solder balls and Cu core balls. In this study, after experiment we know Cu core columns with lower aspect ratio and small core diameter is better for drop test. Cu core columns with higher aspect ratio and less solder amount is better for Thermal Cycle Test.
According to our previous research report, Cu core columns can replace traditional solder balls and Cu core balls, which can effectively realize fine pitch, high density and high performance packaging assembly.
In this report, it is more certain that when using Cu core column in the industry in the future, we must carefully consider the characteristic requirements for reliability (Drop or TCT), and must reach the optimization of the overall package design by aspect ratio, solder amount, and core diameter.
From these results, we can summarize that Cu core columns with lower aspect ratio and small core diameter is better for drop test. Cu core columns with higher aspect ratio and less solder amount is better for Thermal Cycle Test.
