Jet-Dispensed SMT Adhesives for Durable Printed Electronics
This paper discusses the use of jet-dispensed SMT adhesives for increased durability, lower component cost, and new form factor printed electronics.
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Authored By:
Leonard Allison
Engineered Materials Systems, Inc.
100 Innovation Court
Delaware, OH 43015
Summary
Polymer Thick Film (PTF)-based printed electronics (aka Printed Electronics) has improved in durability over the last few decades and is now a proven alternative to copper circuitry. This paper discusses the use of jet-dispensed Surface Mount Technology (SMT) adhesives for increased durability, lower component cost, and new form factor printed electronics. Jet-dispensing enables higher assembly speeds, accurate placement of multiple adhesives, smaller surface mount device (SMD) and Z-axis registration tolerance.
Conclusions
More work is needed to develop robust processing of new form factor substrate for pliable and soft electronic circuitry and electrodes. The challenge lies with handling of the varied new substrate. But the need is popularly recognized, and many material suppliers are committed to delivering better solutions.
Initially Published in the SMTA Proceedings
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