DFX on High Density Assemblies
This paper discusses selection of solder paste based on end product and the need to conduct proper root cause analyses before making any material changes.
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Authored By:
Jonas Sjoberg
Indium Corporation
Kuala Lumpur, Malaysia
Chris Nash, David Sbiroli
Indium Corporation
Utica, NY, USA
Wisdom Qu
Indium Corporation
Suzhou, China
Summary
Implementing high-density assembly in all electronic products requires many considerations. Before starting any development work or implementing a new technology, it is critical to understand the product and industry requirements and capabilities. If this is not fully understood, failure is the most probable outcome.
This paper will discuss selection of the correct solder paste based on the end product and the need to conduct proper root cause analyses before making any material or process changes.
Conclusions
It is very important to understand design, materials, and process since they are very closely connected. There are many ways to achieve high-density assemblies, and it is crucial to have a "toolbox of technologies" to be able to fulfill various requirements. It is also necessary to consider the interaction between multiple technologies in all areas during development and deployment since several advanced technologies will, in most cases, be used on the same product. Depending on the end product, several options can be considered and the selection should be based on data and not assumptions.
Initially Published in the SMTA Proceedings
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