Vapor Phase - Improvement Under Oxidation Free Soldering Conditions
Modern vapor phase soldering systems based on new technologies have eliminated the disadvantages inherent to condensation systems.
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Authored By:
Claus Zabel
ASSCON Systemtechnik GmbH
86343 Konigsbrunn, Germany
Summary
Due to the switch to lead-free, high packing density, extreme mix of light/heavy components manufacturers are faced with multiple new challenges. Simple processing, successful soldering for various products, high quality and user-riendliness are the basic requirements that current soldering systems have to provide. Vapor phase soldering meets these demands. However, individual systems vary greatly when looking at important details.
Conclusions
Modern vapor phase soldering systems based on newest technologies have eliminated the disadvantages inherent to early condensation systems.
Vapor phase soldering offers best reflow thermal treatment technology for all kind of high tech soldering application. By employing saturated vapor not only for the heating but also the pre-heating phase, any risk of oxidization is eliminated. In addition, precise medium temperature settings eliminate overheating of the product in any stage of the soldering process.
Variable temperature gradient control provides optimum pre-heat and soldering for any product. If also a VACUUM or even MULTIVACUUM Process is intergrated into the Vapor phase soldering process best possible and void free quality of soldering is ensured.
Initially Published in the SMTA Proceedings
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