circuitnet
Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD

The Effects of Phosphorus in Lead-Free Solders



The Effects of Phosphorus in Lead-Free Solders
This paper reports on experiments to determine the effects of phosphorus additions on the behavior of a widely used lead-free solder.

DOWNLOAD
Authored By:
Keith Sweatman, Takatoshi Nishimura and Takuro Fukami
Nihon Superior Co., Ltd
Osaka, Japan

Summary

Phosphorus has long been a "secret ingredient" in tin-lead solder, particularly solder made with recycled metal, as it is a powerful deoxidant that removes dross and brings a sparkle to the surface of the molten solder. With the change to high-silver lead-free solders, which have a strong tendency to oxidize and generate large volumes of dross, phosphorus became a widely used but seldom mentioned ingredient.

The solder pot erosion that forced manufacturers to upgrade the materials used in the construction of wave soldering machines is primarily the result of the 100ppm phosphorus commonly included in the formulation of SAC alloys. Now, as solder manufacturers try to distinguish their low- and no-Ag solders from those of those offered by other suppliers, the presence or absence of phosphorus, with or without other antioxidants that have less detrimental side effects, has become a controversial issue.

In this paper the authors will report a series of experiments that have been undertaken to determine the effects of phosphorus additions on the behaviour and properties of a widely used lead-free solder.

Conclusions

The results of laboratory tests and evaluation in soldering processes confirm the conclusions of earlier work that phosphorus does not have a place as an alloying addition in lead-free solders, particularly those that rely on nickel to promote eutectic solidification or stabilize the hexagonal form of the Cu6Sn5 intermetallic.

Phosphorus additions to lead-free solders promote the wetting and consequent erosion of stainless steel machine parts.

When added to tin-copper-nickel solders phosphorus reacts with the nickel reducing the beneficial effects that it has on solder fluidity and Cu6Sn5 stability.

Wetting of copper is slowed.

Erosion of iron plated soldering tool tips is accelerated.

The rate of dross production in tin-copper-nickel alloy that already have germanium as their antioxidant is increased. Rather than working with the germanium synergistically to achieve an even lower rate of drossing, the phosphorus appears to act as an accelerant with the rate of dross production increasing by more than 60%.

Germanium is an effective antioxidant that does not cause the detrimental side effects that occur when phosphorus is used as an alloying addition to control oxidation or for any other purpose.

Initially Published in the SMTA Proceedings
Submit A Comment
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company
Your E-mail


Your Country
Your Comments



Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling