Press Fit Roadmap for High Performance Process
Paper investigates the roadmap for press fit technology, with attention to placement and insertion, inspection, repair, pin design, challenges and solutions.
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Authored By:
Jose Becerra, Dennis Willie and Murad Kurwa
Flextronics
Milpitas, California; Guadalajara, Jalisco
Summary
Press-fit technology is a proven and widely used and accepted interconnection method for joining electronics assemblies. Printed Circuit Board Assembly Systems and typical functional subassemblies are connected through press-fit connectors.
The Press-Fit Compliant Pin is a proven interconnect termination to reliably provide electrical and mechanical connections from a Printed Circuit Board to an Electrical Connector. Electrical Connectors are then interconnected together providing board to board electrical and mechanical inter-connection. Press-Fit Compliant Pins are housed within Connectors and used on Backplanes, Mid-planes and Daughter Card Printed Circuit Board Assemblies. High reliability OEM (Original Equipment Manufacturer) computer designs continue to use press-fit connections to overcome challenges associated with soldering, rework, thermal cycles, installation and repair.
This paper investigates the technical roadmap for press fit technology, putting special attention to main characteristics such, placement and insertion, inspection, repair, pin design trends, challenges and solutions. Critical process control parameters within an assembly manufacturing are highlighted.
Conclusions
In this document was shown the technical roadmap for press fit technology, putting special attention to main characteristics such as placement and insertion, inspection, repair, pin design trends, challenges and potential solutions.
It mentioned the main advantage versus solder and SMT technologies and critical parameters to be considered during the manufacturing process such as: Connector Handling, Pin Compliance, insertion force and insertion tooling.
Initially Published in the IPC Proceedings
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