Development of a Robust 03015 Process
This paper reviews major steps considered and taken for the development of a robust 03015 process. It focuses on the activities for the solder paste print process.
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Authored By:
Robert Alexander Gray
ASM Assembly Systems LLC
Suwanee, GA USA
Summary
This paper will review major steps considered and taken for the development of a robust 03015 process which was successfully demonstrated at the company in-house show during Productronica in November 2013, and it will focus on the activities for the solder paste print process. It will include the following topics:
What likely end product applications for 03015 components were considered for future use and the implications they have on the process design
Component design which drives pad design which in its turn will drive aperture design leading to area ratio calculations to determine workable stencil thicknesses
An overview of transfer efficiency and area ratio in paste printing
An overview of the key results from an extensive study of different stencil technologies to determine the optimum ones to maximize transfer efficiency for given area ratios
A discussion on the need for a safety margin in Area ratio guidelines and the major drivers behind this
Efforts to fully characterize the chosen solder paste to define a robust print process window with respect to operating conditions
Efforts to optimize the printer settings to define a robust print process window
A discussion of the results of the 03015 demonstration that was done several times a day for four days
A discussion on the conclusions of this work and suggestions for further work
Conclusions
More work needs to be done to study the behavior of the other types of 03015 devices and their needs for different solder volumes and optimum pad dimensions to minimize tomb stoning and other defects.
Initially Published in the IPC Proceedings
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