Mitigating Tin Whiskers in Alternative Lead-Free Alloys
As lead-free alloys shift into high reliability electronics, the issue of tin whisker growth remains a primary concern among those in the industry.
DOWNLOAD
Authored By:
Karl F. Seelig
AIM
Cranston, RI USA
Summary
As lead-free alloys shift into high reliability electronics, the issue of tin whisker growth remains a primary concern among those in the industry. Current research shows that there is no perfect alloy for all cases of electronic usage. Industry leaders and researchers continue to study and search for a lead free alloy that is able to withstand harsh environments while maintaining high reliability.
Conclusions
Based on the above work, further research is necessary. As evidenced in this paper, it is likely that tin whiskers can be mitigated by alloy additions and acceptable physical properties can be achieved for high reliability alloys.
Initially Published in the IPC Proceedings
|
