circuitnet
Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD

New High-Performance Organophosphorus Flame Retardant



New High-Performance Organophosphorus Flame Retardant
A non-halogen flame retardant has been developed for high performance applications. Resin performance data are presented.

DOWNLOAD
Authored By:
Kimberly M. White, Ph.D., Daniel De Schryver, Ph.D., and Randy Chaya
Albemarle Corporation
Baton Rouge, Louisiana

Summary

A new non-halogen flame retardant has been developed and is useful for a variety of high performance applications. This non-reactive phosphorus-based material satisfies fire safety needs for a broad range of resins including epoxy, polyolefin, and polyamide.

The combination of excellent flame retardant efficiency, high thermal stability and exceptional electrical properties is unique to this organophosphorus flame retardant and makes it a breakthrough technology for high speed, high frequency use in fast growing wireless and wired infrastructures. Resin performance data, including formulations with synergists, are presented in this paper.

Conclusions

As technology progresses, so does the need for advanced materials. Anticipating this need, this material was developed as a high performance non-halogenated flame retardant technology. This new flame retardant can be processed at high temperatures and has a unique combination of high flame retardant efficiency, high thermal stability and superior electrical properties.

It can be applied in many different resin systems such as those used in printed circuit boards, aerospace, films and fibers, wire and cable, and connector applications. With a high melting point, it is melt blendable in applications where resins are processed at high temperature. The performance characteristics of this flame retardant make it attractive for a broad range of applications.

Initially Published in the IPC Proceedings
Submit A Comment
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company
Your E-mail


Your Country
Your Comments



Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling