Design and Fabrication of Ultra-Thin Flexible Substrate
This study focuses on an approach based on the use of a polyimide substrate for 2.5D/3D ultra-thin packaging applications.
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Authored By:
Yu-Jung Huang, Shen-Li Fu
Department of Electrical Engineering, I-Shou University
Kaohsiung, Taiwan, R.O.C.
Ming-Kun Chen, Yi-Lung Lin
Advanced Semiconductor Engineering Test RD
Kaohsiung, Taiwan 811, R.O.C
Summary
We present the development of a flexible polyimide substrate that act as the conduit for power and signal transmission with the additional features of precise control of the metal trace geometries. Using microfabrication techniques, a metal trace is fabricated that possesses a flexible polyimide-based interconnection. The performance of the design was measured with multimeter. The HFSS simulation result of copper-plated interconnection with a core thickness of 12 um has an impedance value of 50 ohm at 1 GHz.
Investigated of microfabrication were performed using an energy-dispersive spectrometry (EDS) and Zygo Optical Profilometer in order to verify the visual aspects of the Cu interconnection, such as identification the elemental composition of materials, roughness and thickness. The experiment is conducted to study the effect of the process parameters on the Cu film surface properties. The results obtained in this work can be applied to the fabrication of flexible microelectronic devices.
Conclusions
A fine pitch patterned processing sequence for the preparation of interposer used for 3D integration applications was developed and experimentally evaluated. The main features of this technology are the preparation of conductor lines on the FPI, which enable the chip connect to the interposer.
Initially Published in the SMTA Proceedings
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