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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
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Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD
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Insertion Loss Comparisons of High Frequency PCBs
PCBs have been used for many years in low loss, high frequency microwave applications and many have become increasingly complex.
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Authored By:
John Coonrod, Rogers Corporation
Summary
Initially Published in the IPC Proceedings
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Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
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