CO2 Clean Manufacturing Technology
CO2 CleanTech can uniquely address the composite opportunity to reduce both lean and green manufacturing waste.
DOWNLOAD
Authored By:
David Jackson
CleanLogix LLC
Santa Clarita, CA
Summary
CO2 technology offers electronic device manufacturers a robust platform for a variety of precision cleaning and machining applications. Surface and substrate contamination such as flux residues, organics, particulate matter, outgassing residues, ionic residues, and laser and mechanical machining heat can be addressed (uniquely) with this technology. Available CO processes include one or a combination of composite jet sprays, centrifugal liquid immersion, supercritical fluid extraction, and both vacuum and atmospheric plasma surface treatments.
CO technology eliminates or significantly reduces both lean and green waste generation at the production operation level (source) by modifying manufacturing processes such as precision cleaning and machining. Because it is safe and dry, CO2 technology can integrate directly into manufacturing processes and tools to provide in-situ cleaning and/or thermal control.
CO technology can be implemented in a variety of process configurations to meet the constraints of lean production layouts and product flow requirements, including direct integration into existing production lines and equipment where the surface contamination is being generated.
CO2 is a very unique manufacturing agent that affords multiple cost reduction and performance improvement opportunities for electronic device fabrication. Exemplary applications include silicone contamination removal from a surface using a CO2 composite spray, hybrid CO particle-plasma pad surface preparation for gold wire bonding, ceramic flip chip defluxing using centrifugal liquid CO, surface residue removal using a CO composite spray following laser processing, particle removal from a CMOS image sensor following wire bonding, and CO2 -enabled laser machining of organic and ceramic substrates.
Conclusions
CO2 CleanTech transforms electronic device manufacturing operations in a variety of unique ways. CO CleanTech
addresses challenging contamination constraints with cleaner production solutions and a lower cost-of-operation. CO CleanTech serves as an alternative to conventional immersion, extraction, spray and plasma treatment processes. CO CleanTech is uniquely versatile and adaptable to the production of a diverse array of high-reliability products including flexible and hybrid printed circuit boards, CMOS image sensors, optoelectronic devices, microfluidic devices, guidance systems, fuel injection devices, spacecraft components, and disk drive assemblies, among many other examples.
Finally, CO CleanTech is proving to be a superior option in material cleaning and modification processes such as the preparation of bond pads for wire bonding operations. CO cleaning processes produce as good as or better wire bond strength with fewer defects as compared to conventional methods - and without the labor, space, chemical, and energy waste constraints associated with same.
Initially Published in the IPC Proceedings
|
