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Maybe it's the thermocouple connection
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Behavior of Materials in the Manufacturing Environment

This document shows the effect of Dk and Df values from 10GHz to 20GHz and also shows their performance for lead-free assembly.

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Authored By:

Hardeep Heer
FTG
FIRAN TECHNOLOGY GROUP

Summary

This study was conducted to understand seven materials reliability, behavior of Dielectric constant and Dissipation factor over medium to high frequencies. A modified version of HDPUG design was used for evaluation. This test board contains IST, CAF, Thermal Cycling and Impedance (both Micro Strip and Strip line) coupons. In addition to these we added HATS coupons.

Materials were chosen from FR4 family and selection was made based upon our present and future needs. Dielectric constants of these materials ranged from Dk 3.6 to Dk 4.2, as published, at 10GHz. This document shows the effect of Dk and Df values from 10GHz to 20GHz and also shows their performance for lead free assembly process when tested using IST and HATS test methods. In addition CAF testing was done on five of the seven materials.

Initially Published in the IPC Proceedings

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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura