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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Rentals and Rent to Purchase x-ray Systems

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Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD

Revolutionary Technique for Microvia Microsections

This paper describes the design of a test structure that facilitates the evaluation of blind and buried microvias in printed circuit boards.

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Authored By:

Louis Hart, Russell Dudek and Brent Mayfield
Compunetics, Inc.

Summary

We describe the design of a novel test structure, to which we have given the name "HD", that will facilitate the evaluation of blind and buried microvias in printed circuit boards, in comparison with existing, standard test coupons. HD will consume less board space than and be, at least in the case of blind vias, more representative of realistic board structures than standard coupons.

Initially Published in the IPC Proceedings

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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura