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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Rentals and Rent to Purchase x-ray Systems

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Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD

Maximizing the Value of Automatic Inspection

Learn about the role of automatic inspections, SPI data mining, typical SMT process defects, and more in this presentation by Chrys Shea, Christopher Associates.

Authored By:

Chrys Shea
Christopher Associates, Inc.
Santa Ana, CA USA

Summary

Initially Published in the IPC Proceedings

Comments

Feb 14, 2012

Great presentation. So many are still focusing on ATE and the end of the line. Makes so much sense to look for and find errors at the front.

Juan Arocho, CTU

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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura