Embedded Components: Analysis of Reliability
Paper aims at analyzing and confirming the reliability performance of embedded components compared to that of standard SMT components.
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Authored By:
Christopher Michael Ryder
AT&S, Leoben, Austria
Summary
In light of new process and product technologies in the field of embedded components, questions arise with respect to advantages and potential disadvantages to standard SMT component placement when considering reliability. The fact that components are embedded in the substrate opens up new variables in terms of drop test resistance and thermal cycle test.
One may expect fundamental qualitative differences to galvanized bonds within a laminate framework in comparison to current external solder joint performance.
One may expect variations in the component thermal integrity of an embedded component within a substrate and that of a soldered component when subjected to TCT test conditions.
This paper aims at analyzing and confirming the reliability performance (in terms of the above identified test criteria) of embedded components compared to that of standard SMT components through usage of embedded and SMT soldered component test vehicles. These analyses make use of the process technologies and methodologies of the currently running EU-funded project "Hermes".
Initially Published in the IPC Proceedings
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