Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab. Advanced Interconnections Corp.
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Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings. ECD
Stencil Manufacturing and Impact on Precision
Stencil positional accuracy is a function of the manufacturing process. The various parameters that influence positional accuracy are covered.
Ahne Oosterhof
Oosterhof Consulting, Hillsboro, OR, USA
Stephan Schmidt
LPKF Laser & Electronics, Tualatin, OR, USA
Summary
Initially Published in the SMTA Proceedings
Comments
Dec 22, 2016
Well maintained fiber diode lasers, superior metal, and nano coating produce incredibly accurate stencils with improved paste release. However, experienced stencil designers shouldn't be discounted! All the best equipment and materials is useless without experience on the front end.
Mark Devereaux, Photo Etch Technology
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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation. Uyemura
