circuitnet
Sponsor
Advanced Interconnections Corp.
Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.
Rentals and Rent to Purchase x-ray Systems
Sponsor
ECD
Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD

Using X-ray to Detect Counterfeit Components



Using X-ray to Detect Counterfeit Components
Paper provides info about techniques using x-ray photography acquisition to speed the detection and accuracy of inspecting counterfeit components.

DOWNLOAD
Authored By:
Art Ogg
World Micro, Roswell, GA USA

Summary

Much has been said and written about the accuracy of visual attribute inspections of potentially counterfeit components. The techniques and procedures being used to inspectcounterfeit and reworked electronic components in the open marketplace can be quite effective in most cases.

The Independent Distributors of Electronics Association (www.IDofEA.org) has produced an industry acceptedinspection standard, IDEA-STD-1010. It provides a wealth of information about visually inspecting components and in most cases will allow the inspector to make preliminary decisions about the legitimacy of any given part.

This paper will provide additional knowledge about new techniques using x-ray photography acquisition methods recently developed that will speed the detection and accuracy during the process of inspecting counterfeit components.

X-ray photographs of counterfeited parts along with the explanations detailing how they were detected are explained in this document. Often overlooked clues left behind by even the most experienced counterfeiters are discussed.

Conclusions

Given that a detail oriented counterfeit electronic component diagnostician that has been certified to conduct Quality inspections can be quite effective, basing an evaluation solely on a visual attribute process will always have its limitations.

With the current trend over the last 12-18 months in increased craftsmanship displayed by the groups who engage in the act of counterfeiting, it is becoming nearly impossible to detect every style used. It is obvious that more money is being used to increase the Quality of methodologies that produce counterfeit components. Quality inspectors can no longer just look at parts under a microscope and make the final judgment about their legitimacy.
Without the use of an X-ray system to verify the internals of a component, an inspection process has an exposure by making false assumptions about component Quality.

This study has shown examples of how X-ray was used to verify a group of parts with different dies to be certified by the OCM as meeting specifications. It has shown examples of how the inspector has proven parts to be fake, even to the point of not having a die inside the component.

The aerospace, military and especially the medical industries will soon make X-ray a required requisite step that must be included before any organization may certify a group of components to be production ready.

The single most important limitation of utilizing an X-ray system to verify a part is valid, is the inspector cannot usually make a final judgment in the absence of a picture of a known good part for comparison. This can be resolved over time by creating a library of photos that pass all the specifications.

The study has also shown that certain types of manufacturing defects can be seen using X-ray systems along with major EOS/ESD type damages.

Finally, most counterfeit components have had modifications done to the exterior or the component. Not all of these will be detected by visual examination. Some will require the inspector to use an X-ray system. This requirement will become more prevalent as the counterfeiters increase the quality of their work.

Initially Published in the SMTA Proceedings
Submit A Comment
Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company
Your E-mail


Your Country
Your Comments



Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
Uyemura
RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura
Affordable Profiling