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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Rentals and Rent to Purchase x-ray Systems

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Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD

Selecting Fluxes for Lead-free Selective Soldering

Paper touches on identifying flux properties, selecting low solids fluxes for lead-free selective wave, the soldering process and testing.

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Authored By:

Mario Scalzo, Senior Technical Support Engineer
Indium Corporation, Utica, NY, USA

Todd O'Neil, Sales Manager
Juki Automation Systems, Morrisville, NC, USA

Summary

Initially Published in the IPC Proceedings

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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura