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Pin in Paste Plus Preforms to Eliminate Wave Soldering

Study investigates use and limitations of machine placed solder preforms during the top-side SMT reflow process for PTH components.

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Authored By:

Guhan Subbarayan, Scott Priore
Assembly Sciences and Technology, Cisco Systems, Inc.
San Jose, CA USA

Paul Koep, Scott Lewin, Rahul Raut
Cookson Electronics - Assembly Materials
South Plainfield, NJ and Elgin, IL USA

Sundar Sethuraman
Jabil Circuits, San Jose, CA USA

Summary

Initially Published in the IPC Proceedings

Comments

Mar 13, 2017

I was going through the paper presented for Pin in paste process with combination of solder preforms to eliminate wave soldering which was presented in IPC APEXconference,lasvegas,2011. I have few question for this.

(1) How was the equation length of solder paste pushed inside barrel printing=21.4+0.6*Hole diameter reached?
(2) What is the unit for above length of solder paste? Is it mils? It's not volume correct?
(3) If it is length, how do we calculate volume of solder paste pushed inside barrel during printing?
(4) If we use preform, can we reduce the size of paste aperture? If yes, how do we calculate size of preform?

KALPANA DESAI, Flextronics, Inc.

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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura