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Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Rentals and Rent to Purchase x-ray Systems

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Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD

Vapour Phase - Profiling for Lead-Free Alloys

This paper covers the profiling gap with thermal control techniques to address profiles meeting paste manufacturer recommendations.

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Authored By:

Allen Duck
A-Tek LLC, Berthoud, CO, USA

Claus Zabel
Asscon Systemtechnik

Summary

Vapour Phase has seen resurgence in its use recently. In large part this has been a result of new chemistry and the advances in the technology to manage energy flow from the source to the PCB via the vapour. Added the demand from the customer base is again present as we deal with density challenges in PCB design, Parts design as well have to contend with new alloys that are less forgiving than the old traditional 63/37.

Conclusions

The end result of such a mechanism is the freedom to create any shape recommended profile and retain the extremely beneficial characteristics that Vapour Phase offers.

O2 free environment.
Controlled ramp rates.
Low or zero delta Ts at peak
Direct thermal communication with I/O under array packages.
Lower power consumption.

Initially Published in the SMTA Proceedings

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RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura