Controlling the Assembly Process Using SPC
Paper covers methods for statistical process control in a circuit card assembly area.
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Authored By:
William Beair, Alton Moore, and Eric Gilley
Raytheon Company
McKinney, TX, USA
Summary
With increasing deployment of both micro BGA's, 0201discreet and other small components on contemporary CCA designs, the ongoing maintenance of controlled repeatable manufacturing process is more important than ever. As component sizes and pitch decrease, the demand for greater accuracy and repeatability of the assembly equipment increases. Beginning with process characterization, and followed by development of a process control plan to assess, track and control assembly, this paper will discuss a successful methodology for SPC in a CCA process area.
Conclusions
The implementation of a proactive, data driven, statistical program for quality improvement has resulted in tangible results in this CCA shop. By performing routine checks and corrections as needed on parameters that most effect process performance, a steady history of improved quality has been achieved.
Initially Published in the SMTA Proceedings
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