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Emerging Competitors in Emerging Markets



Emerging Competitors in Emerging Markets
Using MEMS packaging as an example, the authors show how a study of published patent applications yield a picture of anticipated competitive environments.

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Authored By:
H. J. Neuhaus, Ph.D., R. A. Fillion, C. E. Bauer, Ph.D.
TechLead Corporation, Portland, OR, USA

Summary

Strategic business decisions begin with assessments of market need, value proposition and differentiation, profit potential and sustainability. Predicting the future implies uncertainty and emerging markets often push forecasting into the realm of guesses and hunches. However, structured analysis of published patents and patent applications provides valuable insight into strategies, aspirations and expected competitive positions long before the first sale in an emerging market.

Using MEMS packaging as an example, the authors show how in emerging markets pending patent applications often out number issued patents and then demonstrate how careful study of public databases for published patent applications yield a detailed picture of anticipated competitive environments as well as quantification of market trends and growth expectations. Finally, the authors apply the IP landscaping method to developing a strategic framework useful for investment, market development and strategic alliance planning.

Conclusions

The authors demonstrated a methodology to analyze patent applications to provide insight into competitive strategies in emerging markets using MEMS packaging as an example. In emerging fields, patent applications typically out-number issued patents. Transient in nature, patent applications reveal the intentions and aspirations of the assignee, which often undergo substantial revision before finalization as an issued patent (or rejection altogether). Because early filing preserves IP rights, and because patent law requires publication of pending applications, patent applications provide a powerful window into competitive strategies in emerging markets.

Initially Published in the SMTA Proceedings
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