Sponsor

Plan Ahead for BGA Device Upgrades
BGA Socket Adapter Systems convert surface mount device packages to through-hole (pinned) assemblies, making it easy to plug and unplug SMT devices in the field or the test lab.
Advanced Interconnections Corp.

Rentals and Rent to Purchase x-ray Systems

Sponsor

Maybe it's the thermocouple connection
If your thermal profiling readings seem inconsistent, the culprit could be your thermocouple attachment method. A recently conducted study revealed some interesting findings.
ECD

Does Contamination Affect Whisker Formation?

This paper will review select failures due to metal whisker formation shorting and data of controlled whisker growth.

DOWNLOAD

Authored By:

Terry Munson and Paco Solis
Foresite Inc.
Kokomo, Indiana USA

Summary

Foresite has investigated many whisker failures and found that consistent high levels of chloride, sulfate and amines are present in and around the areas of whisker formation even in hot dry environments with high stress conditions in the solder joints.

Initially Published in the IPC Proceedings

Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor

RAIG Minimizes Corrosion, Allows Higher Gold on ENEPIG
Paper describes a mixed reaction RAIG electrolyte that minimizes galvanic corrosion and allows higher ENEPIG gold thicknesses, enabling robust designs and world-class quality on target with minimal variation.
Uyemura