circuitnet
Sponsor
Ormet-TLPS

AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
Summit-Interconnect
Sponsor
Master-Bond

Epoxy Offers Ultra High Heat Transfer
Bond EP5TC-80 is a NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity.
Master Bond

Sustainability is Key for Material and Chemistry Choices



Sustainability is Key for Material and Chemistry Choices
OEMs have started adopting sustainable materials and chemistry technologies for their electronics as a part of better ESG score rankings. Sustainability is becoming a key parameter for material and chemistry choices for the next generation electronics. The use of non-toxic options are being evaluated and preferred.
Technical Paper

DOWNLOAD

Authored By:


Kunal Shah, Ph.D.
LILOTREE
WA, USA

Summary


OEMs have started adopting sustainable materials and chemistry technologies for their electronics as a part of better ESG score rankings. Sustainability is becoming a key parameter for material and chemistry choices for the next generation electronics. The use of non-toxic options are being evaluated and preferred.

Several published data suggests the Potassium gold cyanide which is the primary gold salt in the standard immersion gold bath is well known to be a highly toxic substance and it may be fatal if swallowed, contacted or inhaled. It is highly toxic to the environment, especially to aquatic life. Every city/county across the world has allowable cyanide levels (ppm/ppb) in the wastewater regulations; there is a cost associated to bring the gold bath waste to wastewater regulation compliance. Also, mishandling of the gold salt or gold bath may lead to human health and/or environmental issues.

Moreover, recycling and reclaiming the existing precious metals present in the electronic waste is critical instead of resorting to mining these precious metals. The paper will talk about non-toxic (cyanide-free) immersion gold (reduction assisted) option which performs superior to legacy cyanide-based options in terms of stability of the solution and cost-effectiveness. Moreover, recycling and reclaiming of the precious metals/gold from the electronic waste will be discussed.

Conclusions


The novel Ni-free, cyanide-free surface finish offers a sustainable option for next generation electronic assemblies. The solderability results are successful after exhaustive conditions according to MIL-STD-883, method 2003. Also, the sustainable surface finish offers robust solder joints with better reliability compared to ENIG. It has a rose gold appearance and offers cost-savings by tight Gold thickness distribution and lower thickness. Moreover, the recycling and reclaiming the precious metals (i.e. Gold) will help source gold instead of traditional mining. This will promote sustainability and support ESG for OEMs.

Initially Published in the SMTA Proceedings

Comments

No comments have been submitted to date.

Submit A Comment


Comments are reviewed prior to posting. You must include your full name to have your comments posted. We will not post your email address.

Your Name


Your Company
Your E-mail


Your Country
Your Comments



Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Insert Your Email Address

Sponsor
ECD

Affordable Profiling Excellence
Four channels of precision data capture from the most trusted name in thermal profiling. New and improved V-M.O.L.E.™ 2 is the ideal solution for budget-conscious electronics pros. Learn more here.
ECD