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Requirements for the Filler Material Solder Paste for Different Technologies
To date, filler materials based on solder pastes have been qualified for the respective technologies to meet the respective requirements. The article is intended to show which important requirements are necessary for the respective evaluation.
Technical Paper
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Authored By:
Jörg Trodler, Dipl.-Ing.
Trodler-EAVT
Germany
Thomas Ruch
Stannol
Germany
Summary
A trend towards miniaturization has been evident since the introduction of SMD technology (SMT). This was extended with chip on board (CoB) and flip chip technology, which is still considered state of the art in back-end production in the semiconductor industry. Furthermore, there is an increasing demand for power electronic (LE/PE) modules in many areas of individual branches of industry and a trend here to develop a combination of the above technologies. To date, filler materials based on solder pastes have been qualified for the respective technologies to meet the respective requirements. The article is intended to show which important requirements are necessary for the respective evaluation. It will also discuss which intersections exist that make it possible to fall back on a filler material. The challenges, possible qualification measures, optimizations and limitations will be presented.
Conclusions
Major trends are addressed. On one hand the minimization from the Semiconductor to the SMT as well as Power Electronic will be based on the quality of powder and for increasing the reliability based on the alloy composition. For the flux there is no discussion about the activity with zero halogens. Also, no clean is already fixed for SMT and LE/PE. About the ww fluxes depends on activities at the semiconductor industry.
Initially Published in the SMTA Proceedings
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