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Pre & Post Solder AOI for THT
By implementing and automated THT AOI solution, first pass yields improve due to standardized consistent inspection results, increased margins by reducing labor for inspection and rework, production optimization and traceability data is automatically generated for analysis in real time.
Technical Paper
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Authored By:
John Johnson
Electronic Assembly Products, Ltd.
OH, USA
Summary
Currently through-hole technology (THT) processes present some of the biggest challenges in the manufacturing of printed circuit boards. This challenge often contributes to unforeseen costs that are burdened on the manufacturer to absorb from added labor for rework, scrap and higher levels of quality inspections. It is common that manual slide line placements, wave and selective soldering are the biggest contributors to rework and scrap within a site, resulting in a burden the manufacturer must absorb.
Automation of these processes has always been difficult with traditional inspection systems due to the design of traditional automated optical inspection (AOI) machines, complexity of the boards, component heights, and a wide variety of different assembly revisions. Most companies simply add more manual inspection to each step that leads to operator fatigue, more errors, inconsistent results, and higher costs.
By implementing new technologies in THT AOI for pre-solder inspection and post solder inspection, you can standardize your process, lead to higher efficiency, lower rework, scrap, and deliver higher yields. These new technologies have implemented AI to reduce programming time, increase repeatability, handle larger component capability and provide real time statistical process control (SPC) traceability.
By adding pre and post AOI for THT, it will reduce or eliminate your errors and improve your margins. This solution will standardize your THT inspection processes and lead to higher efficiency and productivity.
Conclusions
By implementing an automated THT AOI solution, first pass yields improve due to standardized, consistent inspection results, increased margins by reducing labor for inspection and rework, production optimization, and traceability data is automatically generated for analysis in real time. These key benefits eliminate many current challenges in through-hole technology.
Initially Published in the SMTA Proceedings
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