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The Impact of Harsh Environments and Ionic Contamination on Post-Reflow Circuit Assemblies
Modern electronic assemblies are far more susceptible to this phenomenon. Among the critical issues affecting these assemblies is ionic contamination, which can lead to a series of deleterious processes, including electrochemical migration (ECM).
Technical Paper
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Authored By:
Michael Konrad
Aqueous Technologies
CA, USA
Summary
While there is well documented historical proof that post-reflow circuit assemblies, when subjected to harsh environments, are particularly vulnerable to failure mechanisms that can drastically reduce their performance and longevity. Modern electronic assemblies are far more susceptible to this phenomenon. Among the critical issues affecting these assemblies is ionic contamination, which can lead to a series of deleterious processes, including electrochemical migration (ECM). This paper explores the relationship between harsh environmental conditions, ionic contamination, and the resulting electrochemical effects on circuit assemblies.
Conclusions
The documented failures discussed above serve as critical reminders of the risks posed by electrochemical migration in electronic assemblies. From high-profile space missions to consumer electronics and public infrastructure, the consequences of ECM can be severe, leading to costly recalls, damage to brand reputation, and, in extreme cases, threats to human safety.
Manufacturers must prioritize the mitigation of ECM through a combination of materials selection, cleaning, and design best practices. Thorough cleaning processes and rigorous environmental testing, such as stated in IPC-J-STD001J (section 8) [Figure 7] can significantly reduce the risk of ECM and ensure that electronic assemblies perform reliably even in challenging conditions. Each of these high-profile failures offers valuable lessons that continue to shape the future of electronic design and manufacturing practices.
Initially Published in the SMTA Proceedings
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