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Beyond the Technical Data Sheet
This paper examines process changes and the material properties or performance of polymer composites used in semiconductor packaging and board assembly.
Technical Paper
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Authored By:
Deborah Hagen, Ph.D., Mark Dimke, Ph.D., Erica McCready, Ph.D. Nalini Menon, and April Nissen
Sandia National Laboratories
NM, USA
Summary
The traditional materials science tetrahedron emphasizes the interdependence of process, properties, structure, and performance. For instance, changing a process can affect a material’s properties, or pushing a stretch performance requirement may require tradeoffs in manufacturability. This work explores the usefulness of the materials tetrahedron as it applies to the selection and processing of polymeric composite materials used in microelectronics.
We will examine examples where changes in process can change the material properties or performance of polymer composites used in semiconductor packaging and board assembly, such as adhesives and encapsulants. While the technical data sheet is crucial for initial material selection and guidance on recommended processes, a deeper look at the interplay of process, properties, structure, and performance needs is worthwhile.
Conclusions
While technical data sheets on die attach adhesives provide a wealth of necessary information on these materials to the end-user, it is critical to evaluate selected materials with the prescribed cure schedules and make necessary adjustments prior to incorporation in one’s manufacturing processes. Understanding the influences of cure schedules on glass transition temperatures and volumetric shrinkage of die attach adhesives can be critical to avoiding issues such as die warpage. This can ensure product quality and performance of the component while avoiding poorly made parts, reducing wastage, and increasing yield.
Initially Published in the SMTA Proceedings
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