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Effect of Thermal Cycling Dwell Time on High-Performance Solder Alloys
This paper describes the planning and progress of the experimental program designed to assess the effect of a 60-minute temperature cycling dwell time.
Technical Paper
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Authored By:
Richard Coyle, Dave Hillman, Tim Pearson, Michael Osterman, Joe Smetana, Keith Howell, Julie Silk, Hongwen Zhang, Jie Geng, Derek Daily, Anna Lifton, Morgana Ribas, Raiyo Aspandiar, Faramarz Hadian, Chloe Feng, Ranjit Pandher, Jayse McLean, James Wertin, Babak Arfaei, Jean-Christophe Riou, Madan Jagernauth, Denny Fritz, Shantanu Joshi, Jasbir Bath, Stuart Longgood, and Andre Kleyner
Summary
The past decade has seen the development and introduction of commercial, third-generation, high-performance Pb-free solder alloys designed to meet the requirements of higher temperature use environments. Most of these offerings are based on the Sn-Ag-Cu (SAC) system, with major alloying additions of bismuth (Bi), antimony (Sb), or Indium (In). These elements, individually or in combination, promote additional precipitate, solid solution, or dispersion strengthening that can enhance resistance to degradation at elevated temperature or during aggressive thermal cycling.
Results from the literature show that an increase in thermal cycling dwell time can decrease the thermal cycling reliability of SAC solders. Because high-performance alloys are designed for extended operation at higher temperatures, it is important to characterize their reliability at extended thermal cycling dwell times. This paper describes the planning and progress of the experimental program designed to assess the effect of a 60-minute temperature cycling dwell time on the thermal fatigue performance and microstructure of third generation, high-performance Pb-free solder alloys.
Initially Published in the SMTA Proceedings
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