| Sponsor |
|
PCB Rework Evolves, With X-ray a Constant Support
Mini Micro Stencil, a contract manufacturer focused on PCB rework, has relied on real-time X-ray inspection to verify its precision rework as the industry has evolved over 30 years.
Glenbrook Technologies
|
|
| Sponsor |
|
Epoxy Offers Ultra High Heat Transfer
Bond EP5TC-80 is a NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity.
Master Bond
|
|
Adiabatic & Isothermal Humidification for Electronics Manufacturing
The need for including humidification into a well-rounded electronics manufacturing facilities’ ESD program is discussed.
Technical Paper
DOWNLOAD
|
Authored By:
Richard Williams, MBA, BSM
Carel USA
PA, USA
Summary
Humidification is a key component of an effective ESD program and a process control system (a set of procedures designed to ensure that processes within a manufacturing plant are carried out correctly and that the desired output will be achieved) in an electronics manufacturing facility. Humidification assists in achieving company process control goals by providing another “tool” a company can use to manufacture products that meet company QA/QC standards while reducing costs associated with waste (scrap, rework, etc.) through a robust ESD regime that integrates humidification throughout the program.
Secondary effects of providing humidification in electronics manufacturing are increased company ROI and bottom line profitability. This paper provides a closer look at the interconnectedness of adiabatic humidification, improved process control and financial performance.
Conclusions
In this paper, the need for including humidification into a well-rounded electronics manufacturing facilities’ ESD program, waste and costs attributed to ESD occurrences, adiabatic and isothermal humidification technology, and energy savings and rebates available to a facility for using energy savings technology (adiabatic humidification) are reviewed. Multiple areas that contribute to waste from ESD occurrences and facility energy savings costs and rebates were studied. The most under looked component of humidification, energy savings, and its effect on ROI and company bottom line profitability were presented.
Initially Published in the SMTA Proceedings
|
Comments
|
No comments have been submitted to date.
|
|
|
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
| Sponsor |
|
AIT ORMET® TLPS for Thermal Conductivity
AIT ORMET® TLPS is proven with stress relief for stable long-term metallic thermal conductivity & low thermal interface resistance for high temp >175°C
Ormet TLPS
|
|
|
