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Epoxy Offers Ultra High Heat Transfer
Bond EP5TC-80 is a NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity.
Master Bond
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What Causes Solder Balls During Hand Soldering?
To many operators believe the old myth that flux is your friend and you can never have to much flux. That is not true as to much flux will outgas at the end of the hand soldering process creating solder balls around the connection. This is one possible explanation as others have stated other causes as well.
Board Talk
Board Talk is presented by Phil Zarrow and Jim Hall of ITM Consulting.
Process Troubleshooting, Failure Analysis, Process Audits, Process Set-up
CEM Selection/Qualification, SMT Training/Seminars, Legal Disputes
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Phil Zarrow
With over 50 years experience in PCB assembly, Phil is one of the leading experts in SMT process failure analysis.
He has vast experience in SMT equipment, materials and processes.
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Jim Hall
A Lean Six-Sigma Master Blackbelt, Jim has a wealth of knowledge in soldering, thermal technology, equipment and process basics.
He is a pioneer in the science of reflow.
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Reflow Solderable TIM1 Thermal Grease
AIT's CGR7016 & CGR7019-LB series are proven reliable for thermal interface usage at extreme temperatures. 100% chip to heat-spreader lid seal after multiple reflow soldering.
AI Technology, Inc.
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