| Sponsor |
|
AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
|
|
| Sponsor |
|
Epoxy Offers Ultra High Heat Transfer
Bond EP5TC-80 is a NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity.
Master Bond
|
|
Counterfeit Electronics Component Conundrum with Smart Labeling
Electronics manufacturers hurting from supply chain disruptions and component shortages are challenged by the rise in counterfeit components.
Technical Paper
DOWNLOAD
|
Authored By:
Ron Ducharme
Vice President of Business Development
Covectra
Summary
Electronics manufacturers already hurting from supply chain disruptions, component shortages, and a trade war are further challenged by the rise in counterfeit components. Often made with substandard parts, some of which are recycled and many that resemble an authentic product, these fakes are frequently aimed at the defense, aerospace, automotive, and medical industries and cause safety concerns and degraded performance. Faulty components in a medical device can cause inaccurate readings or incorrect diagnosis. And defective parts in defense, aerospace, automotive can literally have life or death consequences.
Conclusions
The use of smart label technology along with the track and trace system allows components to be monitored via a dashboard. Supply chain managers can follow components through their entire trip of the supply chain, from the moment of manufacture to the part’s application. They can see whether or not the product was delayed or in the wrong location. Through the dashboard, they can also view if there is any secondary movement of the product. Smart labeling technology is the most effective and cost-efficient counterfeit prevention method on the market today.
|
Comments
|
No comments have been submitted to date.
|
|
|
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
| Sponsor |
|
Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
|
|
|