| Sponsor |
|
AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
|
|
| Sponsor |
|
Epoxy Offers Ultra High Heat Transfer
Bond EP5TC-80 is a NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity.
Master Bond
|
|
Simulation and Fault Diagnosis in Post-Manufacturing Mixed Signal Circuits
In this paper, an effective method for predicting circuit failures in post-market circuit boards through simulation and deep learning is proposed and implemented.
Technical Paper
DOWNLOAD
|
Authored By:
Kyle Pawlowski, Sumit Chkravarty, Arjun Kumar Joginipelly
Kennesaw State University
GA, USA
Summary
A major problem in circuit board remanufacturing is the identification of parametric faults from age or stress to the individual passive components. We propose a deep machine learning system for simulating and identifying such faults. A simulated dataset is generated for the most common faults in a circuit. This dataset is used to train deep machine learning classification algorithms to identify and classify the faults. The accuracy of system is measured by comparing with real circuit boards in operation.
Conclusions
In this paper, an effective method for predicting circuit failures in post-market circuit boards through simulation and deep learning is proposed and implemented. Normally, such failures are hard to diagnosis and difficult to fix. This test can be performed quickly to provide results that can lead to circuit fixes. We have shown that with a small amount of development time, real tests can be created for circuits that incorporated this method. The accuracy of the networks shown here support the idea that the time saved repairing circuit boards using the proposed method can far exceed the costs of misclassifications. With verification from real circuit boards in operation, we know that our data provides an accurate ground truth for the deep network to learn.
Initially Published in the SMTA Proceedings
|
Comments
|
No comments have been submitted to date.
|
|
|
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
| Sponsor |
|
High-Reliability for Low-Temp Processes
Durafuse® LT low-temp, high-rel solder paste is bismuth-free, reduces warpage in large BGAs, enhances thermal cycling, drop shock reliability and reduces energy use up to 15%.
Indium Corporation
|
|
|
