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PCB Rework Evolves, With X-ray a Constant Support
Mini Micro Stencil, a contract manufacturer focused on PCB rework, has relied on real-time X-ray inspection to verify its precision rework as the industry has evolved over 30 years.
Glenbrook Technologies
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Epoxy Offers Ultra High Heat Transfer
Bond EP5TC-80 is a NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity.
Master Bond
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Glass Panel Packaging: Technologies and Applications
This paper describes the critical glass packaging technologies, their R&D and commercialization status as well as all the current and future applications.
Technical Paper
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Authored By:
Rao Tummala, Bartlet Deprospo, Shreya Dwarakanath,
Siddharth Ravichandran, Pratik Nimbalkar,Nithin Nedumthakady, and Madhavan Swaminathan
3D Systems Packaging Research Center, Georgia Institute of Technology
GA, USA
Summary
The semiconductor and systems landscape are changing dramatically. As Moore's law begins to come to an end for many reasons that include minimal increase in transistor performance and in computer performance from node to node but at higher power, the industry has begun to shift to interconnections, referred to as Moore's law for Packaging. This focus addresses both the need for homogeneous and heterogeneous integrations by interconnecting smaller chips and smaller components with higher performance at lower cost and interconnecting them as multichip in 2.5 and 3D architectures. This is also called extending Moore's law, not in a single chip but with multiple chips interconnected horizontally and vertically.
This strategy is very consistent with the dramatic and emerging changes in electronic systems such as in HPC, AI and a new era of self-driving and electric cars that potentially think and drive better than humans. This requires device, packaging, and computing architecture paradigms with an entirely different vision and strategy than transistor scaling alone. Packaging, which can be viewed broadly as system scaling, is now viewed as replacing Moore's law for enabling better devices and better systems, unlike in the past.
Glass packaging is being developed by Georgia Tech and its industry partners, as the most leading-edge packaging, consistent with the above systems needs in cost, performance, functionality, reliability, and miniaturization. It compares and contrasts glass packaging against other leading-edge technologies such as Si and embedded packaging.
Conclusions
Glass packaging is emerging as next generation packaging platform beyond organic and silicon packaging. It has been developed in both chip first and chip-last 2.5D and 3D architectures. Georgia Tech and its industry partners have developed all the building block technologies necessary to manufacture. Currently two companies are making plans to manufacture in 2020.
Initially Published in the SMTA Proceedings
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Low Outgassing, Glob Top Epoxy
Master Bond EP17HTND-CCM is a glob top epoxy that meets NASA low outgassing specifications and forms high strength bonds to a wide variety of similar/dissimilar substrates.
Master Bond
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