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AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
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Epoxy Offers Ultra High Heat Transfer
Bond EP5TC-80 is a NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity.
Master Bond
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CU Core Column Enables Fine Pitch & High-Density 3D Packaging
The diameter, length, and aspect ratio of the Cu core columns and how to optimize the dimensions of the Cu core column is discussed.
Technical Paper
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Authored By:
Lewis Huang, Hiroki Sudo, Daisuke Soma, Hiroshi Okada
Senju Metal Industry Co., Ltd.
Tokyo, Japan
Summary
As the next-generation interconnection materials, Cu core column is a kind of cylindrical-shaped copper core with Ni and solder plating. It could replace ordinary solder balls, Cu core balls and even Cu plated posts and has become the focus of attention. Cu core columns have innately ability to control and maintain a consistent standoff height, and can achieve excellent electrical and thermal conductivity due to the excellent physical properties of copper.
It is known that the Cu core column can exhibit sufficient performance compare with solder balls and Cu core balls. In this study, after experiment we know Cu core columns with lower aspect ratio and small core diameter is better for drop test. Cu core columns with higher aspect ratio and less solder amount is better for Thermal Cycle Test.
Conclusions
According to our previous research report, Cu core columns can replace traditional solder balls and Cu core balls, which can effectively realize fine pitch, high density and high performance packaging assembly.
In this report, it is more certain that when using Cu core column in the industry in the future, we must carefully consider the characteristic requirements for reliability (Drop or TCT), and must reach the optimization of the overall package design by aspect ratio, solder amount, and core diameter.
From these results, we can summarize that Cu core columns with lower aspect ratio and small core diameter is better for drop test. Cu core columns with higher aspect ratio and less solder amount is better for Thermal Cycle Test.
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Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
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