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Single Device Traceability in Assembly without ECID
The recent evolution of data analytics allows correlation analysis from wafer fab to wafer test to assembly and packaging to product level test and field performance.
Technical Paper
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Authored By:
Dave Huntley
PDF Solutions
Summary
Use cases, solutions and standards for single device traceability in the supply chain to enable root case analysis, recall containment, device pairing, yield and reliability improvement and liability protection.
Single device tracking (SDT) refers to the tracking of individual electronic assets such as dice, packages, PCBs, etc. The quality, reliability, performance and security of an asset is determined by its components (assets and consumables) and the process steps and conditions used to manufacture it.
The recent evolution of data analytics allows correlation analysis from wafer fab to wafer test to assembly and packaging to product level test and field performance. Such analysis offers further in-depth yield learning and may identify new issues such as silicon test coverage gaps and systematic and random defects introduced at assembly or found only during product level or system level test.
Conclusions
Single device tracking without ECID will become a mandatory requirement for a wide range of applications, not just the high reliability segments like medical, automotive and military, but relatively low cost and less critical consumer products also. The high reliability products continue to require near perfect reliability, i.e. zero defects in the field. The challenges inherent in the very fast ramp to high volume for new consumer products drives the requirement for single device tracking for all components and materials in an electronic part to maintain high yields and rapid respond to excursions. Fortunately, the equipment and software suppliers can now offer solutions based on SEMI standards in a timely and cost-effective manner.
Initially Published in the SMTA Proceedings
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