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Extending 3D MRS Sensor Technology to Address Challenging Applications
There is an increasing need for highly accurate 3D inspection and measurement capabilities for applications in SMT, semiconductor and metrology markets.
Technical Paper
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Authored By:
Dick Johnson, John Hoffman Ph.D.
CyberOptics Corporation
MN, USA
Summary
There is an increasing need for highly accurate 3D inspection and measurement capabilities for applications in SMT, semiconductor and metrology markets.
3D Multiple Reflection Suppression (MRS) sensor technology has been effectively combined with Automated Optical Inspection for several years and is now being utilized for many SPI applications such as microelectronics and sub-100-micron solder paste deposits and other challenging applications, like packaging, automotive, medical and other applications with stringent quality requirements. In addition to inspection, there is an increasing need to capture coordinate measurements in-line.
Phase shift profilometry (PSP) is widely used for 3D automated optical inspection (AOI) by electronics manufacturers assembling printed circuit boards (PCB) using automated surface mount technologies (SMT). Conventional PSP measurements are significantly challenged by inaccuracies caused by multiple reflections between surfaces on the inspected object. Multiple Reflection Suppression (MRS) sensor technology addresses this challenge. The sensor’s unique optical architecture and the system’s proprietary image fusing and processing algorithms provide fast, accurate 3D characterization capabilities that are well suited to other important applications, including solder paste inspection (SPI) and measurements typically performed by coordinate measurement machines (CMM).
Coordinate measurements can now be attained in seconds, rather than the hours or days it would take a traditional coordinate measurement machine. MRS sensor technology provides significant advantages in speed, accuracy and resolution over the alternate technologies. This technology is a key building block for achieving high accuracy at production speed for Automated Optical Inspection (AOI), Solder Paste Inspection (SPI) and Coordinate Measurement (CMM) applications.
Conclusions
MRS sensor technology delivers much needed improvement in 3D inspection applications. Its combination of a unique optical architecture, sophisticated image fusing algorithms and multiple reflection suppression addresses important limitations of more conventionally-designed systems. Its ability to provide metrology-grade results at the speed of production promises to further expand its use in challenging automated optical inspection of surface mounted assemblies, solder paste inspection and various coordinate measurement applications.
Initially Published in the SMTA Proceedings
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