| Sponsor |
|
AIT ORMET® TLPS for Proven Reliability
AIT ORMET® TLPS is proven for outstanding reliability for High and Ultra High-Density Interconnection and high temperature build-up Layer Interconnection beyond 175°C
Ormet® TLPS
|
|
| Sponsor |
|
Epoxy Offers Ultra High Heat Transfer
Bond EP5TC-80 is a NASA low outgassing rated epoxy that achieves a thermal conductivity of 3.3-3.7 W/(m·K), while also retaining its electrical non-conductivity.
Master Bond
|
|
Solderability Testing Protocols and Component Re-Tinning Methods
This paper addresses methods to enhance solderability including: component solderability test methodologies, gold embrittlement and removal of gold plating.
Technical Paper
DOWNLOAD
|
Authored By:
Bob Klenke
ITM Consulting
Coeur d'Alene, ID, USA
Summary
In 1983 the Department of Defense (DoD) determined that over 40% of military electronics system field failures were electrical in nature and some 50% of these failures were due to poor solder connections. Plated finishes, usually nickel or tin, were found to be porous and non-intermetallic allowing oxide penetration to the base metal which led to poor solder joint integrity and therefore resulted infield failures. As a result the MIL-STD-883 solderability testing standard was instituted to assure that all components in high-reliability applications were indeed solderable and plated finishes gave way in favor of a hot solder dip finish which provides a fused SnPb homogeneous tin-lead finish.
This paper addresses several testing protocols and methods to enhance solderability including: component solderability test methodologies, gold embrittlement and removal of gold plating, component re-tinning, component refurbishing, and QFN coplanarity.
Conclusions
Solderability is no longer an option for many high-reliability segments of the world's electronics assembly industry. With implementation of the latest Rev F of J-STD-001, solderability testing, gold removal and component retinning have become prerequisites for doing business and remaining competitive in the global electronics marketplace.
Initially Published in the SMTA Proceedings
|
Comments
|
No comments have been submitted to date.
|
|
|
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.
Insert Your Email Address
|
| Sponsor |
|
Dedicated Tool for Process Development
Advanced plating capability at Uyemura Tech Center: Process Development, UBM, pilot production. ENIG, ENEPIG, EPIG/EPAG, RAIG immersion gold; all substrates. On-site analysis.
Uyemura
|
|
|
