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Nanocopper Based Paste for Solid Copper Via Fill
This paper discusses a nano copper based paste for use in via filling.
Technical Paper
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Authored By:
David Ciufo, Sujatha Ramanujan, Janet Heyen, Michael Carmody
Intrinsiq Materials Inc. Rochester, NY
Sunny Patel
Candor Industries Inc., Ontario, CA
Summary
This paper discusses a nano copper based paste for use in via filling. The company manufactures nano copper and disperses the coated nano copper into a paste in combination with micron copper. The resultant paste is injected or fills a via. The via is subsequently sintered by means of photonic sintering, or by heat in a reducing environment. The process will be accomplished in under an hour and results in filled solid copper vias.
Conclusions
The company has developed a nano copper based paste well suited for via filling. With high conductivity, long life, and environmentally cleaner process, the Intrinsiq paste offers an excellent option. This paste can be utilized with standard via fill, and may enable quick turn manufacturing. The next steps include investigating us of a more typical Hydrogen/Nitrogen flow in the oven. In addition, Intrinsiq plans to work with industry standard via fill techniques.
Initially Published in the IPC Proceedings
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