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| Industry Press |
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September 15, 2017
Zymet UA-3307-B Edgebond Adhesive for Automotive Applications Zymet has introduced UA-3307-B, a new edgebond adhesive to enhance board level reliability in automotive and other harsh environment applications. BGA's whose ... Zymet Inc. More Information February 12, 2021 Visualizing Microstructure Degradation in Board Level Reliability Testing Zymet has posted a paper, first presented at ECTC 2020, Visualizing Microstructure Degradation in Board Level Reliability Testing at https://youtu.be/kFcWyivJPVA. Residual ... August 19, 2019 Zymet: Enhancing Board Level Reliability for Harsh Environments At the SMTA International 2019 technical conference, Portland State University and Zymet will present their investigations on enhancing the board level reliability ... May 20, 2019 ECTC Feature from Zymet At the 2019 IEEE 69th Electronics Component and Technology Conference, ECTC, Zymet will be featuring a reworkable edgebond adhesive that has recently ... November 1, 2018 Zymet's Reworkable Edgebond Adhesive at APEX 2019 At the IPC's APEX EXPO, Zymet will be featuring a reworkable edgebond adhesive that has recently been shown to be capable of significantly enhancing the board level reliability ... October 31, 2018 On the Board Level Reliability at SMTAi 2018 This month, the SMTAi 2018 conference was held at the Rosemont Convention Center, Rosemont, IL. One notable topic pertained to the board level reliability of low temperature ... October 9, 2018 Zymet & MK Electron Co, Will Present Their Board Level Reliability of LTS At the SMTA International 2018 technical conference, Portland State University, Zymet, Inc., and MK Electron Co, Ltd., will present their investigation on the board level reliability of low temp ... January 12, 2018 Zymet UA-3307-B Edgebond Adhesive for Automotive Board Level Reliability At APEX Expo 2018, Zymet will be featuring its recently introduced edgebond adhesive, UA-3307-B, for enhancing board level reliability in automotive and other harsh environment ... September 15, 2017 Zymet UA-3307-B Edgebond Adhesive for Automotive Applications Zymet has introduced UA-3307-B, a new edgebond adhesive to enhance board level reliability in automotive and other harsh environment applications. BGA's whose ... June 2, 2017 Zymet Reworkable Edgebond Adhesive for Automotive Board Level Reliability Zymet's reworkable edgebond adhesive, UA-2605-B, has been shown to enhance the board level reliability of a large WLCSP. The work has been performed and published ... September 28, 2016 SMTAi paper regarding Edgebond Adhesive for enhancing BLR Zymet's reworkable edgebond adhesive, UA-2605-B, has been shown to enhance the board level reliability of a large WLCSP. The work was performed in a collaborative ... |
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