|
|
|
|
| Industry Press |
|
January 7, 2016
Rogers Corp Offers Practical Insights into Testing Rogers Corp Offers Practical Insights into Testing and Using Advanced Circuit Materials at DesignCon Chandler, Arizona -- Rogers Corporation (NYSE:ROG) will be exhibiting and educating at the upcoming DesignCon (www.designcon.com). Now in its 21st year, DesignCon is a premiere event for design chip-circuit-and system-level engineers working on high-frequency analog and high-speed digital circuits. DesignCon 2016 is scheduled for January 19-21, 2016 (January 20-21 for the exhibition) at the Santa Clara Convention Center (Santa Clara, CA). On the conference side, John Coonrod, Technical Marketing Manager for Rogers Advanced Connectivity Solutions, and author of the popular ROG Blog series, will participate in a 75-minute panel discussion targeting effective measurement methods for high-frequency/high-speed printed-circuit-board (PCB) materials. This technical presentation will focus, in particular, on frequencies above 10 GHz, as needed for a growing number of applications, including many emerging wireless communications systems. Conducted by the IPC D-24c task group (www.ipc.org) on High Frequency Test Methods, the round-robin-style panel discussion ("Track 05: Characterize PCB Materials and Processing") will explore the properties of some of the latest circuit materials and examine different methods for testing and characterizing those materials. Joining John Coonrod in the discussion will be Glenn Oliver, Senior Engineer at DuPont, and Don DeGroot, President of CCN. Also, Dr. Allen F. Horn III will be presenting "Effect of conductor profile structure on propagation in transmission lines" at 9:20 AM on Thursday, January 21 and participating as a member of the August panel discussion "Getting smooth copper and keeping it" at 3:45 PM on Thursday, January 21. As part of the DesignCon Expo Hall, representatives from Rogers Corp. (www.rogerscorp.com) will be exhibiting at Booth #702, with information and insight on the use of their circuit materials, including ULTRALAM® 3850HT, CLTE-XT™, and RO3003™ laminates. Rogers will also be previewing their new material system developed for ultra low loss digital applications. ULTRALAM 3850HT high-temperature (HT) liquid-crystal-polymer (LCP) circuit material delivers high yields in multilayer circuits. Its high melt temperature of +330°C improves multilayer layer-to-layer registration and offers improved thermal stability, while its low effective dielectric constant (3.14 @10GHz), low loss (0.002), and thin core offerings make it an ideal circuit material for millimeter frequencies, including 77 GHz used in long range automotive collision-avoidance radar systems. Being highly impermeable, it is an attractive alternative to ceramic for MMIC (monolithic microwave integrated circuit) packaging. CLTE-XT laminates are formulated for use in some of the most demanding phase-sensitive applications in communications, radar and electronic-warfare (EW) circuits and systems. These composite materials are ceramic-filled PTFE based circuit materials with woven fiberglass reinforcement. With eXtended Technology, CLTE-XT laminates maintain a low Dk of 2.94 across wide temperature ranges. CLTE-XT laminates provide excellent dimensional stability, with lower loss than the original CLTE™ circuit materials. Also featured at DesignCon will be RO3003 laminates clad with rolled copper. Smooth rolled copper, paired with the very low dielectric loss of the RO3000° PTFE-ceramic resin system, result in high frequency circuit materials with best-in-class insertion loss. These laminates are ideal for loss-critical millimeter wave frequency designs, where consistent circuit performance matters, such as automotive radar sensors and point-to-point microwave backhaul communications systems. While already a benchmark for 77 GHz automotive radar sensors, RO3003 3.0 dielectric constant laminates are also available with rolled copper foils from 1/2 ounce up to 0.040" thick rolled copper plate. Rogers Corporation More Information September 14, 2023 Rogers Corp. to Highlight Materials for Millimeter Wave Designs at PCB West Rogers Corporation will exhibit at PCB West in Santa Clara, CA (booth #201) highlighting some of its high performance circuit materials used in multilayer structures ... April 25, 2023 Rogers Corp. to Exhibit at Del Mar Electronics & Manufacturing Show Rogers Corporation will exhibit at the Del Mar Electronics & Manufacturing Show April 26th & 27th at the Del Mar Fairgrounds in San Diego, CA (booth #622). High performance ... January 31, 2023 Rogers Corporation Exhibiting at DesignCon 2023 Rogers Corporation will exhibit at DesignCon in Santa Clara, CA (booth #614) highlighting some of its high performance circuit materials. DesignCon is a premiere ... January 24, 2023 Rogers Corp. and Fortify Joint Agreement to Promote 3D Printing Technology Rogers Corporation and 3D Fortify Inc. entered into an expanded agreement to jointly promote Fortify’s 3D printing equipment and Rogers' 3D printable ... January 20, 2023 Rogers Corp. to Highlight Next Generation Innovative Materials at IPC APEX Rogers Corporation (NYSE: ROG) will be exhibiting in booth #409 at IPC APEX EXPO in San Diego, CA Jan. 24th - 26th, highlighting some of its next generation ... September 21, 2022 Rogers Corp Highlights Advanced Materials at Defense TechConnect Summit Rogers Corporation will exhibit its advanced material solutions for Aerospace & Defense markets at the Defense TechConnect Summit & Expo 2022, Booth # 513, at the ... June 15, 2022 Rogers Corporation to Exhibit & Present Technical Topics at 2022 IMS Rogers Corporation has announced that Technical Marketing Manager, John Coonrod, will give 3 presentations on June 21st in the MicroApps Theater at the International ... June 2, 2022 Rogers Expands RO3003G2 Laminates with Thinner Copper Foil Option Rogers Corporation expanded the copper foil options available with RO3003G2™ laminates to include thinner, 9 micron electrodeposited HVLP foil. Expanded copper foil ... April 26, 2022 Rogers Corporation to Present High Performance Circuit Materials at Del Mar Rogers Corporation will exhibit at the Del Mar Electronics & Manufacturing Show May 4th and 5th at the Del Mar Fairgrounds in San Diego, CA (booth #622). High performance ... April 5, 2022 Rogers Corp. to Exhibit at DesignCon 2022 Rogers Corporation will exhibit at DesignCon in Santa Clara, CA (booth #518) highlighting some of its high performance circuit materials used in multilayer structures ... |
|
Free Newsletter Subscription
Circuitnet is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. Insert Your Email Address |
|
|