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| Industry Press |
October 10, 2023
New Technical Paper Unveils Key Strategies for Successful BGA ReworkHaverhill, MA USA - Circuit Technology Center has released a new technical paper highlighting six common mistakes encountered during BGA rework operations. This new paper offers valuable insights and effective methods to help prevent their occurrence. See the full paper here: https://www.circuitrework.com/tech-papers/1093.html ########## Circuit Technology Center, founded in 1979, continues to be recognized as the most innovative and reliable specialist in circuit board damage repair, rework, BGA re-balling, and component level modification services in the world. For more information, please visit www.circuitrework.com. Phone: 978-374-5000, Fax: 978-372-5700, Web: www.circuitrework.com. Circuit Technology Center More Information June 1, 2026 Circuit Technology Center Expands BGA Reballing with Additional Reflow Oven Circuit Technology Center, Inc. announced the purchase of an additional reflow oven to support the company's growing high-volume BGA reballing operations. The investment ... April 13, 2026 IPC-7712 Development Advances at IPC APEX EXPO Significant progress was made in developing the proposed standard IPC-7712, Component Safe Removal for Failure Analysis and Reclamation, during in-person meetings ... March 17, 2026 IPC Launches Development of New Standard: IPC-7712 Component Safe Removal Industry experts from across the electronics manufacturing sector will meet this week to continue formal development work on a new IPC standard titled IPC 7712 ... February 24, 2026 White Paper Explores Cold Precision Milling for Underfilled BGA Removal Circuit Technology Center, Inc. has released a technical white paper: Cold Precision Milling for Underfilled BGA Component Removal. Available at www.circuitrework.com ... October 7, 2025 Circuit Technology Center Expands Robotic Tinning Capacity Circuit Technology Center, Inc. is pleased to announce the addition of two new Hentec/RPS Odyssey 1325 robotic hot solder dip component lead tinning machines to ... September 18, 2024 Circuit Technology Center Announces Expanded Tinning Services Capacity Circuit Technology Center announces it has expanded its electronic component tinning services capacity. Four (4) Hentec-Odyssey 1325 robotic hot solder dip machines ... November 14, 2023 Circuit Technology Center Announces New Component Trim and Form Service Circuit Technology Center announces it has added the capability to trim and form electronic component packages to customers' exact pre-assembly specifications. ... October 10, 2023 New Technical Paper Unveils Key Strategies for Successful BGA Rework Circuit Technology Center has released a new technical paper highlighting six common mistakes encountered during BGA rework operations. This new paper offers valuable ... July 14, 2023 Whitepaper Discusses Critical Process Steps for BGA Device Re-balling The re-balling of BGA components from lead-free to tin-lead solder is a critical requirement by some high-reliability customer applications due to tin-whisker ... June 8, 2023 CircuitMedic Unveils the Ultimate Tool Set for Electronics Techs CircuitMedic has assembled the ultimate benchtop tool set for serious electronics technicians and professionals. This curated selection of nine finely-crafted tools ... |
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